C4B controlled collapse chip connection

Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips andmicroelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry

 

setup C4 Flip Chip Pads/Bumps in Encounter 

 
VERSION 5.6 ;

BUSBITCHARS "[" ;

DIVIDERCHAR "/" ;

MACRO bump_70N

CLASS COVER BUMP ;

FOREIGN bump_70N -47.0 -47.0 ;

ORIGIN 47.0 47.0 ;

SIZE 94.0 BY 94.0 ;

PIN PAD

DIRECTION INOUT ;

USE SIGNAL ;

PORT

LAYER AP ;

POLYGON -19.47 -47.0 19.47 -47.0 47.0 -19.47 47.0 19.47 19.47 47.0 -19.47 47.0 -47.0 19.47 -47.0 -19.47 ;

END

END PAD

END bump_70N



END LIBRARY