Cu-Piller
Copper pillar bump(CPB) technology is to produce a bump on the surface of Flip chip package which has the electric and heat conductivity and the resistance to electrical migration. It’s different from the traditional solder bump. Each heat dissipation copper pillar is the same as the micro-solid heat pump. The heat dissipation bumping can integrate to a part of the standard flip chip package and is connected with the electric bumping (uses on power supply、grounding and signal). The technique provides the new heat dissipation function of the electronic component which can also integrate with transistor, resistor and capacitor to the circuit design.
This technique will extend the traditional solder bumping application and provides flip chip package component to initially cooling function. Its electric generate ability has copper pillar used the recycle energy. Before this technique, the solder bumping can only provide the mechanical heat dissipation function.
This technique will extend the traditional solder bumping application and provides flip chip package component to initially cooling function. Its electric generate ability has copper pillar used the recycle energy. Before this technique, the solder bumping can only provide the mechanical heat dissipation function.
Features
Good Heat dissipation lower electrical resistance/inductivity lower thermal resistance better resistance to electrical migration Offer the more fine pitch Comply with RoHS specification - Cu post + SnAg capApplication:
High pin logic IC Memory & Mobile Apparatus LED Sub-mount Automotive Electronic Component Bio-Medical devices
No comments:
Post a Comment