IC packaging

IC are packaged in many types they are: 

1.  BGA1
2.  BGA2
3.  Ball grid array
4.  CPGA
5.  Ceramic ball grid array
6.  Cerquad
7.  DIP-8
8.  Die attachment
9.  Dual Flat No Lead
10.  Dual in-line package
11.  Flat pack
12.  Flip chip
13.  Flip-chip pin grid array
14.  HVQFN
    
15.  LQFP
16.  Land grid array
17.  Leadless chip carrier
18.  Low insertion force
19.  Micro FCBGA
20.  Micro Leadframe Package
21.  MicroLeadFrame
22.  Mini-Cartridge
23.  Multi-Chip Module
24.  OPGA
25.  PQFP
26.  Package on package
27.  Pin grid array
28.  Plastic leaded chip carrier
29.  QFN
30.  QFP
31.  Quadruple in-line package
32.  ROM cartridge
33.  Shrink Small-Outline Package
34.  Single in-line package
35.  Small-Outline Integrated Circuit
36.  Staggered Pin Grid Array
37.  Surface-mount technology
38.  TO220
39.  TO3
40.  TO92
41.  TQFP
42.  TSSOP
43.  Thin small-outline package
44.  Through-hole technology
45.  UICC
46.  Zig-zag in-line package